Realization of high aspect ratio interconnections based on macroporous silicon

Conference paper (2002)

Authors

A Nichelatti Electronic Components, Technology and Materials - EEMCS
NT Nguyen Electronic Components, Technology and Materials - EEMCS
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2002

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials