Multi-Physics Driven Electromigration Study: Multi-Scale Modeling and Experiment

Doctoral thesis (2021)

Authors

Z. Cui Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

DOI: https://doi.org/10.4233/uuid:839e79d1-ea4b-4440-9077-d6fb2df4c086

Multiphysics Electromigration Simulation Multiscale, Accelerated Measurement Stress-Migration Self-Diffusion Thermomigration Molecular Dynamic Simulation Finite Element Simulation

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Published Date

2021

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

This dissertation presents a comprehensive and integrated study, including theory development, numerical simulation and experiment, for multi-physics driven electromigration in microelectronics. Multi-scale methodologies from atomistic modeling to continuum theory-based simulation have been developed. Moreover, extensive experimental testing, from testing wafer/die design and fabrication, sample preparation and process, to the measurement setup and characterization, has been conducted. The dissertation also provides synergetic and cohesive analysis between simulation and experiment. The simulation predictions and results have been well validated by experimental data.

Files

PhD_dissertation_Zhen_Cui.pdf

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- Embargo expired in 30-04-2022