Thermal aging of molding compounds

Conference paper (2010)

Authors

Kaspar M B Jansen Computational Design and Mechanics
J de Vreugd Computational Design and Mechanics
LJ Ernst Computational Design and Mechanics
C Bohm External organisation
Research Group
Computational Design and Mechanics
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Published Date

2010

Language

English

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Research Group

Computational Design and Mechanics

Abstract

The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the glass transition
temperature increased and that these effects are accompanied with a relatively large amount of shrinkage. All effects can be interpreted in terms of the formation of an oxidized layer where extra crosslinking occurred.

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