Thermal aging of molding compounds

Conference paper (2010)

Authors

K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
J de Vreugd Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
C Bohm External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2010

Language

English

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the glass transition
temperature increased and that these effects are accompanied with a relatively large amount of shrinkage. All effects can be interpreted in terms of the formation of an oxidized layer where extra crosslinking occurred.