Assembly Induced Failures in Thin Film MEMS Packages

Conference paper (2009)

Authors

J.J.M. Zaal Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering , Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
JTM van Beek External organisation
GQ Zhang External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

In the growing MEMS market Wafer Level Thin Film Packages can be applied to an increasing numer of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.