Through-wafer copper electroplating for RF silicon technology

Nguyen, NT; Ng, TK; Boellaard, E; Pham, NP; Craciun, G; Sarro, Pasqualina M; Burghartz, JN

Through-wafer copper electroplating for RF silicon technology

Conference paper (2002)

Authors

NT Nguyen Electronic Components, Technology and Materials

TK Ng Old - EWI Ch. Integrated Sensing Devices

E Boellaard Electronic Components, Technology and Materials

NP Pham Electronic Components, Technology and Materials

G Craciun Electronic Instrumentation

Pasqualina M Sarro Electronic Components, Technology and Materials

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Electronic Components, Technology and Materials

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Published Date

2002

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Research Group

Electronic Components, Technology and Materials