Modeling and characterization of molding compound properties during cure

Jansen, K.M.B.; Qian, C.; Ernst, LJ; Bohm, C; Kessler, A; Preu, H.; Stecher, M

Modeling and characterization of molding compound properties during cure

Journal article (2009)

Authors

K.M.B. Jansen Computational Design and Mechanics

C. Qian Computational Design and Mechanics

LJ Ernst Computational Design and Mechanics

C Bohm External organisation

A Kessler External organisation

H. Preu External organisation

M Stecher External organisation

Research Group

Computational Design and Mechanics

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Published Date

2009

Language

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Research Group

Computational Design and Mechanics

Abstract

During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die.

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