Effect of Thermomigration on Electromigration in SWEAT Structures

Conference paper (2023)

Authors

Z. Cui Electronic Components, Technology and Materials - EEMCS
Xuejun Fan Lamar University
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2023 Z. Cui, Xuejun Fan, Kouchi Zhang
DOI: https://doi.org/10.1109/EuroSimE56861.2023.10100774
More Info
expand_more

Published Date

2023

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

This paper investigates thermomigration (TM) and electromigration (EM) in SWEAT structure. Firstly, the distribution of temperature along SWEAT structure during EM is obtained by using finite element (FE) simulation. The FE simulation results show that the temperature is almost uniformly distributed in the most region of narrow line in SWEAT structure, but temperature decreases rapidly at both sides of conductor. Accordingly, the temperature gradient in the narrow line of SWEAT structures is calculated. Then, we apply the obtained temperature and temperature gradient in the governing equation of EM in terms of atomic concentration. The numerical results show that the TM caused by temperature gradient causes the material depletion near both ends of conductor. At the same time, atoms diffuse from the middle region of conductor to both sides driven by the atomic concentration, causing the voids in middle of conductor.

Files

Effect_of_Thermomigration_on_E... (pdf)
(pdf | 0.661 Mb)
- Embargo expired in 17-10-2023