A back-wafer contacted silicon-on-glass integrated bipolar process - Part I: the conflict electrical versus thermal isolation

Nanver, L.K.; Nenadovic, N; d' Alessandro, V; Schellevis, H.; van Zeijl, H.W.; Dekker, R.; de Mooij, DB; Zieren, V; Slotboom, JW

A back-wafer contacted silicon-on-glass integrated bipolar process - Part I: the conflict electrical versus thermal isolation

Journal article (2004)

Authors

L.K. Nanver Electronic Components, Technology and Materials -

N Nenadovic Electronic Components, Technology and Materials -

V d' Alessandro External organisation

H. Schellevis Electronic Components, Technology and Materials -

H.W. van Zeijl Electronic Components, Technology and Materials -

R. Dekker External organisation

DB de Mooij External organisation

V Zieren External organisation

JW Slotboom Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2004

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials