Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages

Conference paper (2023)

Authors

R. Sattari Electronic Components, Technology and Materials -

H.W. van Zeijl Electronic Components, Technology and Materials -

Kouchi Zhang Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

DOI: https://doi.org/10.1109/EuroSimE56861.2023.10100771

Epoxy molding compound Electromagnetic compatibility In-package relative humidity sensor Shielded interdigital electrodes Encapsulation layer Electrical field lines Through polymer vias

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Published Date

2023

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to maximize the electrical field lines to pass through the EMC and enhance the sensitivity. The manufactured wafer includes 6×6mm2 dies, each containing six identical capacitive sensors with an area of 480 × 620 μ m2. SU-8 through polymer vias (TPVs) with high aspect ratio were created to locally mold the sensors by EMC. The linear capacitance change with the relative humidity level is simulated in COMSOL Multiphysics. Three designs were compared, and the calibration results show the capacitance value of 1.54 pF and 5.85 pF before and after molding, respectively. The capacitance value stays within the range of 5.85 to 5.86 pF with less than 7 aF variation under different biasing voltages, indicating the stability and robustness of the capacitance.

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- Embargo expired in 17-10-2023