High temperature storage influence on molding compound properties

Conference paper (2010)

Authors

J de Vreugd Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
C Bohm External organisation
R Pufall External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
More Info
expand_more

Published Date

2010

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

An electronic device cannot perform its designed functions until it is packaged such that it is interconnected with the rest of the system and protected. As an encapsulation material, thermosetting polymers are widely used. It is well known that properties of polymerbased
composites like molding compounds are highly affected by the influence of temperature, relative humidity and degree of conversion. The effect of above mentioned internal and external circumstances are investigated extensively in the past. Surprisingly the effect of high temperature storage on the mechanical properties is scarcely studied. From literatures research it is concluded that high temperature storage and postcure treatments
increases the glass transition temperature. Also a weight loss during high temperature storage is reported [1], [2]. Since thermal treatments are very common in micro
electronic industry, it is relevant to understand in more detail the influence of thermal aging on the mechanical properties of molding compounds. In this research the effect of postcure and thermal aging on the mechanical properties of molding compounds is systematically studied. It turns out that postcure and thermal aging cause a broadening of the viscoelastic region, an increase in Tg, and increase in rubbery modulus and ongoing shrinkage of the molding compound. It is concluded that the change in properties can be
attributed to a reaction of the molding compound with oxygen. This paper presents the observed change in properties caused by oxidation.