Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology

Nanver, L.K.; Gonda, V; Milosavljevic, S.; Goudena, E.J.G.; Civale, Y; Scholtes, T.L.M.; La Spina, L.; Schellevis, H.; Lorito, G.; Sarubbi, F; Popadic, M; Buisman, K.

Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology

Conference paper (2008)

Authors

L.K. Nanver Electronic Components, Technology and Materials -

V Gonda Old - EWI Sect. ECTM

S. Milosavljevic Electronic Components, Technology and Materials -

E.J.G. Goudena Old - EWI Sect. ECTM

Y Civale Old - EWI Sect. ECTM

T.L.M. Scholtes Electronic Components, Technology and Materials -

L. La Spina Old - EWI Sect. ECTM

H. Schellevis Electronic Components, Technology and Materials -

G. Lorito Old - EWI Sect. ECTM

F Sarubbi Electronic Components, Technology and Materials -

M Popadic Electronic Components, Technology and Materials -

K. Buisman Electronics -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2008

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials