Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

Jiang, Chengshuo; Fan, Jiajie; Qian, Cheng; Zhang, Hao; Fan, Xuejun; Guo, Weiling; Zhang, Kouchi

Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

Journal article (2018)

Authors

Chengshuo Jiang Beijing University of Technology, Changzhou Institute of Technology Research for Solid State Lighting

Jiajie Fan Beijing Research Center, Hohai University, Changzhou Institute of Technology Research for Solid State Lighting

Cheng Qian Beihang University, Changzhou Institute of Technology Research for Solid State Lighting

Hao Zhang Beijing Research Center, Changzhou Institute of Technology Research for Solid State Lighting

Xuejun Fan Lamar University, Changzhou Institute of Technology Research for Solid State Lighting

Weiling Guo Beijing University of Technology

Kouchi Zhang Changzhou Institute of Technology Research for Solid State Lighting, Electronic Components, Technology and Materials - , Chinese Academy of Sciences

Research Group

Electronic Components, Technology and Materials () (TU Delft)

Reliability Reliability Light emitting diodes Microassembly Substrates Thermal resistance Chip-scale package (CSP) Flip-chip die attach High-power light-emitting diode (LED) Mechanical factors Voids.

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Published Date

2018

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip technology have become one of the most promising light sources. The die attach solder layer always plays an important role in heat dissipation, mechanical support, and electronic conductivity. Among different types of solder materials, Sn-3.0Ag-0.5Cu (SAC305) solder alloy shows its great competitiveness on solderability and mechanical properties for the interconnection of high-power LED CSPs. However, reliability problems caused by voids in the SAC305 solder limit its wide application in the high-power LED chip-scale packaging process. Existence of the voids has been considered as one of the major issues causing chip-on-substrate level reliability problems in microelectronic and optoelectronic devices. In this paper, mechanical and thermal properties of SAC305 solder layers with arbitrary voids used in high-power LED CSPs are studied with both finite-element simulations and experiments. The results show that void size and void position within the solder layer are the two most critical issues on the shear strength of interconnection and the chip-on-substrate level thermal distribution in high-power LED CSPs.

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