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PP
Ph Philipov
Academic Work (3)
Conference paper (1)
Journal article (2)
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3 records found
1
Opportunities for applications of electrochemical deposition of copper for filling holes and channals in silicon wafer structures
Journal article (2001) -
VG Kiutchukov (author)
,
Ph Philipov (author)
,
C Schmidt (author)
Electrochemical deposition of copper in thin layers on planar surface [Russische tekst]
Journal article (2000) -
VG Kiutchoukov (author)
,
Ph Philipov (author)
,
C Schmidt (author)
Possibilities for application of electrochemical deposition of Cu for hole and channel filling in Si substrates
Conference paper (1999) -
VG Kiutchoukov (author)
,
Ph Philipov (author)
