The introduction of silicon carbide(SiC) has reduced the superiority of traditional silicon-based power module pack-aging strategies. As packaging strategies become increasingly complex, classical thermal modelling tools often prove inadequate in balancing efficiency with accuracy. Integrating these tools with machine learning (ML) can significantly enhance their application potential. This discussion commences by addressing the pressing issues in thermal modelling of SiC modules, specifically the challenges associated with multiple heat sources and heat spreading. During the design stage, ML models can swiftly simulate the thermal response of various packaging strategies, aiding engineers in eliminating ineffective options. In the monitoring phase, the employment of a digital twin enables a deeper investigation into degradation phenomena. This article reviews the current status and explores the potential applications of ML in thermal modelling of SiC power modules.