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S Orain

Conference paper (1)

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Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology

Conference paper (2006) - Willem D. van Driel (author) , AM Grech (author) , Torsten Hauck (author) , I Schmadlak (author) , X Zhang (author) , S Orain (author)