A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

Conference paper (2006)

Authors

J Su External organisation
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
SL Paalvast Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
J. van Eijk Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2006

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials