Is TSV-based 3D integration suitable for inter-die memory repair?

Conference paper (2013)

Authors

Mihai Lefter Computer Engineering
George Voicu Computer Engineering
Mottaqiallah Taouil Computer Engineering
M. Enachescu Computer Engineering
S Hamdioui Computer Engineering
S.D. Cotofana Computer Engineering
Research Group
Computer Engineering
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Published Date

2013

Language

English

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Research Group

Computer Engineering

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