On-chip isolation in wafer-level chip-scale packages: substrate thinning and circuit partitioning by trenches

Sinaga, SM; Poliakov, A; Bartek, M.; Burghartz, JN

On-chip isolation in wafer-level chip-scale packages: substrate thinning and circuit partitioning by trenches

Conference paper (2003)

Authors

SM Sinaga Old - EWI Ch. Integrated Sensing Devices

A Poliakov Old - EWI Ch. Integrated Sensing Devices

M. Bartek Old - EWI Ch. Integrated Sensing Devices

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

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Published Date

2003

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Research Group

Old - EWI Ch. Integrated Sensing Devices