Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

Videlot, C; Ackermann, J; Fages, F; Nguyen, NT; Wang, L; Sarro, Pasqualina M; Crawly, D; Nikolic, K; Forshaw, M

Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

Journal article (2004)

Authors

C Videlot External organisation

J Ackermann External organisation

F Fages External organisation

NT Nguyen Electronic Components, Technology and Materials -

L Wang Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

D Crawly External organisation

K Nikolic External organisation

M Forshaw External organisation

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2004

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials