Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging

Conference paper (2003)

Authors

P Mendes Electronic Components, Technology and Materials - EEMCS
A Poliakov Old - EWI Ch. Integrated Sensing Devices
M. Bartek Old - EWI Ch. Integrated Sensing Devices
JN Burghartz Old - EWI Ch. Integrated Sensing Devices
JH Correia External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2003

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials