Optimization techniques for grayscale photolithography

Conference paper (2012)

Authors

F.C.M. van Kempen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
A. van Keulen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Y Hirai External organisation
O Tabata External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2012

Language

English

Reuse Rights

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

With the ongoing development of thick photoresists, promising possibilities have
emerged to use these transparent and flexible layers for micro-structures and micropatterns directly and not exclusively as a sacrificial layer in the processing. These 3D
polymer microstructures have many potential applications in the field of MEMS:
including micro-sensors and actuators, micro-optics and micro-fluidics. Using modern
3D exposure techniques, it is possible to vary the dissolution rate of thick photo resists
locally and create complex relief-type three-dimensional structures in just one exposure
and development cycle. Unfortunately, realizing the proper exposure conditions needed
for a specific 3D micro pattern is complicated, because of the non-linear and smoothing
nature of the physical processes. Nowadays, the most widely used approach is based on
trial-and-error designed exposure conditions. In this research a systematic approach is
developed, based on computational process simulation, associated adjoint sensitivity
analysis and optimization techniques.