Monolithic 3D Wafer Level Integration

Koladouz Esfahani, Zahra

doi:10.4233/ca460c12-bf40-4f40-9240-d6c8aa5c37ca

Monolithic 3D Wafer Level Integration

Applied for Smart LED Wafer Level Packaging

Doctoral thesis (2017)

Authors

Zahra Koladouz Esfahani Electronic Components, Technology and Materials

Contributors

Guo Qi Zhang Electronic Components, Technology and Materials (promotor)

H.W. Van van Zeijl EKL Processing (copromotor)

Research Group

Electronic Components, Technology and Materials

DOI: https://doi.org/10.4233/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca

LED System-in-Package 3D wafer-level integration High aspect ratio lithography Multi-step imaging Smart silicon interposer Side-wall photodiode Blue/UV selective photodetector Sensor readout BiCMOS process Wafer-level optic Multidisciplinary simulation Optical simulation

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http://resolver.tudelft.nl/uuid:ca460c12-bf40-4f40-9240-d6c8aa5c37ca

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Published Date

2017

Language

English

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Research Group

Electronic Components, Technology and Materials

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