Effect of isothermal ageing on the microstructure, shear behaviour and hardness of the Sn58Bi/SnAgCuBiNi/Cu solder joints

Journal article (2021)

Authors

Jian Chang Yangzhou University, Harbin University of Science and Technology
Yang Liu Yangzhou University
H. Zhang Electronic Components, Technology and Materials - EEMCS
Min Zhou Yangzhou University
Xue Yuxiong Yangzhou University
Xianghua Zeng Yangzhou University
Rongxing Cao Yangzhou University
Penghui Chen Yangzhou University
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2021

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

The microstructure, shear behaviour and hardness of the SnBi/SACBN/Cu solder joint before and after isothermal ageing were investigated in comparison with the SnBi/Cu and SACBN/Cu solder joints. The experimental results indicated that the pre-soldered SACBN joint had a significant effect on the formation and growth of the β-Sn grains in the SnBi bulk solder. The brittleness of the SnBi/SACBN/Cu composite solder joint was also suppressed and its failure mode transformed from brittle failure to brittle-ductile failure after reflow. However, the shear strength and failure mode of the SnBi/SACBN/Cu composite solder joint became similar to those of the SnBi/Cu joints after 600 h isothermal ageing. The shear strength of the three kinds of solder joints decreased after isothermal ageing, but the SnBi/SACBN/Cu composite solder joint showed higher shear strength than SnBi/Cu did during ageing. The shear strength of the composite solder joint was 67.1MPa after ageing. Due to the diffusion of elements in the isothermal ageing process, the microstructure of the composite solder joint was significantly coarsened after ageing for 600 hours. This phenomenon further led to the decrease of the hardness and shear strength of the three kinds of solder joints.

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