Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger

Santagata, Fabio; Mele, L.; Mihailovic, M; Morana, Bruno; Creemer, J.F.; Sarro, P. M.

Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger

Conference paper (2009)

Authors

Fabio Santagata Electronic Components, Technology and Materials

L. Mele Electronic Components, Technology and Materials

M Mihailovic Electronic Components, Technology and Materials

Bruno Morana Electronic Components, Technology and Materials

J.F. Creemer Electronic Components, Technology and Materials

P. M. Sarro Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2009

Language

English

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Research Group

Electronic Components, Technology and Materials

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