Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger

Santagata, F.; Mele, L.; Mihailovic, M.; Morana, B.; Creemer, J.F.; Sarro, Pasqualina M

Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger

Conference paper (2009)

Authors

F. Santagata Electronic Components, Technology and Materials -

L. Mele Electronic Components, Technology and Materials -

M. Mihailovic Electronic Components, Technology and Materials -

B. Morana Electronic Components, Technology and Materials -

J.F. Creemer Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2009

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials