Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger

Conference paper (2009)

Authors

F. Santagata Electronic Components, Technology and Materials -

L. Mele Electronic Components, Technology and Materials -

M. Mihailovic Electronic Components, Technology and Materials -

B. Morana Electronic Components, Technology and Materials -

J.F. Creemer Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

To reference this document use:

http://resolver.tudelft.nl/uuid:c16e6cb4-f70c-4511-840a-74b735d5042f

More Info

expand_more

Published Date

2009

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials