A novel dual-side fabrication method for silicon plate springs with high out-of plane stiffness

van Zeijl, Henk; Su, J; Paalvast, SL; Sarro, Lina; van Eijk, J.

A novel dual-side fabrication method for silicon plate springs with high out-of plane stiffness

Conference paper (2006)

Authors

Henk van Zeijl Electronic Components, Technology and Materials -

J Su External organisation

SL Paalvast Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering

Lina Sarro Electronic Components, Technology and Materials -

J. van Eijk Mechatronic Systems Design - Mechanical, Maritime and Materials Engineering

Research Group

Electronic Components, Technology and Materials () (TU Delft)

Https://repository.tudelft.nl/Thing_bd7ce288-b2ed-4e21-8755-b408c0e16639 Elektrotechniek Techniek

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Published Date

2006

Language

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials