High-resistivity polycrystalline silicon as rf substrate in wafer-level packaging

Poliakov, A; Sinaga, SM; Mendes, P; Bartek, M.; Correia, J.H.; Burghartz, JN

High-resistivity polycrystalline silicon as rf substrate in wafer-level packaging

Journal article (2005)

Authors

A Poliakov Old - EWI Ch. Integrated Sensing Devices

SM Sinaga Old - EWI Ch. Integrated Sensing Devices

P Mendes Electronic Components, Technology and Materials -

M. Bartek Old - EWI Ch. Integrated Sensing Devices

J.H. Correia External organisation

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

To reference this document use:

http://resolver.tudelft.nl/uuid:b97e34ac-2a3b-49fd-9202-2e795f7f4c58

More Info

expand_more

Published Date

2005

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Old - EWI Ch. Integrated Sensing Devices