Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

Journal article (2022)

Authors

Peijie Liang Liang Guilin University of Electronic Technology
Zhiliang Pan Pan Guilin University of Electronic Technology
Liang Tang Tang Guilin University of Electronic Technology
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS , Guilin University of Electronic Technology
Daoguo Yang Guilin University of Electronic Technology
Siliang He He Guilin University of Electronic Technology, Guangdong Academy of Sciences
Haidong Yan Yan Zhejiang University, Guilin University of Electronic Technology
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2022 Peijie Liang, Zhiliang Pan, Liang Tang, Kouchi Zhang, Daoguo Yang, Siliang He, Haidong Yan
DOI: https://doi.org/10.3390/ma15062232
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Published Date

2022

Language

English

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed. The MD result reveals that compared with the sintering process using large-scale silver particles, the sintering process using multi-scale silver particles would enhance the densification under the same sintering conditions, which authenticates the feasibility of adding small silver particles to large-scale silver particles in theory. In addition, to further verify the feasibility of the multi-scale sintering, a semi in-situ observation was prepared for a sintering experiment using micro-nano multi-scale silver paste. The feasibility of multi-scale silver sintering is proved by theoretical and experimental means, which can provide a meaningful reference for optimizing the sintering process and the preparation of silver paste for die-attach in powering electronics industry. In addition, it is hoped that better progress can be made on this basis in the future.