Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process

Koladouz Esfahani, Z.; Ma, Teng; Kolahdouz, Mohammadreza; van Zeijl, H.W.; Zhang, Kouchi

Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process

Journal article (2017)

Authors

Z. Koladouz Esfahani Electronic Components, Technology and Materials -

Teng Ma Student

Mohammadreza Kolahdouz University of Tehran

H.W. van Zeijl Electronic Components, Technology and Materials -

Kouchi Zhang Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

BiCMOS process Temperature sensor Photodetectors Optoelectronics Light-emitting diodes Flash ADC Light sensor Sensor readout system Wafer level package

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http://resolver.tudelft.nl/uuid:af7fca5a-bdf8-450e-ba39-d0a72244c04d

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Published Date

2017

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Today, finding a low cost, efficient, functional and reliable solution for controlling smart lighting systems has become topic of many research groups and industry. In this study, a multi-functional wafer level package (WLP) for phosphor-based white LED system has been designed and manufactured using 7-mask BiCMOS process. This package integrates 4 high power blue LED dies with a temperature sensor and a blue selective light sensor for monitoring system performance. Each sensor has been designed, characterized and calibrated to be part of the smart monitoring unit. An interdigitated power transistor and a 4-bit flash analog-to-digital converter (ADC) were also monolithically integrated with sensors’ readout and extra controlling functions.

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