Direct bonding of processed LPCVD silicon nitride films (U-SP-2-I-ICT)

Pandraud, G.; French, P.J.; Hsu, CL; Creemer, J.F.; Wolff, J.C.; Thijsse, B.J.; Sarro, Pasqualina M

Direct bonding of processed LPCVD silicon nitride films (U-SP-2-I-ICT)

Conference paper (2006)

Authors

G. Pandraud QN/High Resolution Electron Microscopy

P.J. French Electronic Instrumentation -

CL Hsu External organisation

J.F. Creemer Old - EWI Sect. ECTM

J.C. Wolff Old - EWI Ch. Integrated Sensing Devices

B.J. Thijsse OLD Virtual Materials and Mechanics

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

QN/High Resolution Electron Microscopy

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Published Date

2006

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Research Group

QN/High Resolution Electron Microscopy