Characterization of waferstepper and process related front- to backwafer overlay errors in bulk micro machining using electrical overlay test structures

van Zeijl, H.W.; Bijnen, FGC; Slabbekoorn, J

Characterization of waferstepper and process related front- to backwafer overlay errors in bulk micro machining using electrical overlay test structures

Conference paper (2004)

Authors

H.W. van Zeijl Electronic Components, Technology and Materials -

FGC Bijnen External organisation

J Slabbekoorn Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

Https://repository.tudelft.nl/Thing_a2edf032-d956-4472-8b79-00d45270316a Elektrotechniek Techniek

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Published Date

2004

Language

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials