Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

Tang, J.; Gruber, D; Schelen, JBJ; Funke, H-J; Beenakker, C.I.M.

Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

Journal article (2012)

Authors

J. Tang Electronic Components, Technology and Materials -

D Gruber External organisation

JBJ Schelen External organisation

H-J Funke External organisation

C.I.M. Beenakker Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2012

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials