Thermal simulation of flexible LED package enhanced with copper pillars

Liu, Yang; Leung, SYY; Wong, K.Y.; Yuan, CA; Zhang, Guo-Qi

Thermal simulation of flexible LED package enhanced with copper pillars

Journal article (2015)

Authors

Yang Liu Electronic Components, Technology and Materials

SYY Leung External organisation

K.Y. Wong Electronic Components, Technology and Materials

CA Yuan External organisation

Guo-Qi Zhang Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2015

Language

English

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Research Group

Electronic Components, Technology and Materials

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