Direct wafer bonding of processed LPCVD silicon nitride films

Hsu, CL; Creemer, JF; Pandraud, G.; Wolff, J.C.; Thijsse, B. J.; Sarro, Pasqualina Maria; French, Paddy

Direct wafer bonding of processed LPCVD silicon nitride films

Conference paper (2006)

Authors

CL Hsu External organisation

JF Creemer Old - EWI Sect. ECTM

G. Pandraud QN/High Resolution Electron Microscopy

J.C. Wolff Old - EWI Ch. Integrated Sensing Devices

B. J. Thijsse OLD Virtual Materials and Mechanics

Pasqualina Maria Sarro Electronic Components, Technology and Materials

Paddy French Electronic Instrumentation

Research Group

Old - EWI Sect. ECTM

Elektrotechniek Techniek

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Published Date

2006

Language

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Research Group

Old - EWI Sect. ECTM

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