Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives

Bartek, M.; Sinaga, SM; Mendes, P; Correia, J.H.; Burghartz, JN

Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives

Conference paper (2004)

Authors

M. Bartek Old - EWI Ch. Integrated Sensing Devices

SM Sinaga Old - EWI Ch. Integrated Sensing Devices

P Mendes Electronic Components, Technology and Materials -

J.H. Correia External organisation

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

Elektrotechniek

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Published Date

2004

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Research Group

Old - EWI Ch. Integrated Sensing Devices