Induced Delamination of Silicon-Molding Compound Interfaces

Conference paper (2009)

Authors

G. Schlottig Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
H Pape External organisation
B Wunderle External organisation
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation the setup allows for the investigation of interfaces at package scale.