Novel system-in-package design and packaging solution for solid state lighting systems

Conference paper (2014)

Authors

M. Dong Electronic Components, Technology and Materials - EEMCS
F. Santagata Electronic Components, Technology and Materials - EEMCS
J. Wei Electronic Components, Technology and Materials - EEMCS
C Yuan External organisation
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2014

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials