In-package MEMS-based thermal actuators for micro-assembly

Journal article (2006)

Authors

VA Henneken Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering
M. Tichem Micro and Nano Engineering - Mechanical, Maritime and Materials Engineering
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Micro and Nano Engineering (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2006

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Micro and Nano Engineering

Abstract

Abstract. The paper describes the first fabrication and experimental results in the on-going development of MEMS-based electrothermal actuation devices for lateral XY positioning of an optical fibre to a laser diode chip to improve their coupling efficiency and reduce the overall packaging cost. The deflection performance of bulk silicon U- and V-beam thermal actuators with and without fibre loading has been experimentally determined. This is a part of an investigation of the feasibility of an alternative method of performing micro-assembly tasks, i.e. by means of product-internal assembly functions.