Through-wafer copper electroplating for three-dimensional interconnects

Nguyen, NT; Boellaard, E; Pham, NP; Kutchoukov, VG; Craciun, G; Sarro, Pasqualina M

Through-wafer copper electroplating for three-dimensional interconnects

Journal article (2002)

Authors

NT Nguyen Electronic Components, Technology and Materials -

E Boellaard Electronic Components, Technology and Materials -

NP Pham Electronic Components, Technology and Materials -

VG Kutchoukov Electronic Instrumentation -

G Craciun Electronic Instrumentation -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

Elektrotechniek Techniek

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Published Date

2002

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials