Predictive modeling of board level shock-impact reliability of the HVQFN-family

Journal article (2010)

Authors

J extern de Vries External organisation
W Balemans External organisation
W.D. van Driel Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2010

Language

English

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

A semi-empirical model is derived to predict the board level drop-impact lifetime of HVQFN-packages soldered on a printed circuit board. The strain that evolves in the soldered interconnections is evaluated by a finite element model and related to the experimentally determined lifetime. The result is a power law and it is compared to literature data. In addition, a measure for the strain on the board is obtained analytically and compared with the experimental data. Here, too, dependence in the form of a power law is found. The combination of both results strongly suggests a near-linear relationship between the strain in the solder and the strain in the board.