Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering

Journal article (2014)

Authors

Y. Liu External organisation
J Zhao External organisation
CCA Yuan External organisation
Guo Qi Z Zhang Electronic Components, Technology and Materials
F Sun External organisation
Research Group
Electronic Components, Technology and Materials
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Published Date

2014

Language

English

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Research Group

Electronic Components, Technology and Materials

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