DRIE and bonding assisted low cost MEMS processing of inplane HAR inertial sensors

Conference paper (2008)

Authors

V. Rajaraman Electronic Instrumentation - EEMCS
K.A.A. Makinwa Electronic Instrumentation - EEMCS
P.J. French Electronic Instrumentation - EEMCS
Research Group
Electronic Instrumentation (EEMCS) (TU Delft)
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Published Date

2008

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Instrumentation