Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

Liu, P.; Zhang, J.; Sokolovskij, R; van Zeijl, H.W.; Mimoun, B.A.Z.; Zhang, Kouchi

Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

Conference paper (2013)

Authors

P. Liu Electronic Components, Technology and Materials -

J. Zhang Electronic Components, Technology and Materials -

R Sokolovskij External organisation

H.W. van Zeijl Electronic Components, Technology and Materials -

B.A.Z. Mimoun Electronic Components, Technology and Materials -

Kouchi Zhang Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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http://resolver.tudelft.nl/uuid:58777ea0-1fa6-4250-9491-6f7ac6c2d7a9

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Published Date

2013

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials