Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

Liu, P.; Zhang, Jing; Sokolovskij, R; van Zeijl, Henk W.; Mimoun, B.A.Z.; Zhang, Guo-Qi

Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

Conference paper (2013)

Authors

P. Liu Electronic Components, Technology and Materials

Jing Zhang Electronic Components, Technology and Materials

R Sokolovskij External organisation

Henk W. van Zeijl Electronic Components, Technology and Materials

B.A.Z. Mimoun Electronic Components, Technology and Materials

Guo-Qi Zhang Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2013

Language

English

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Research Group

Electronic Components, Technology and Materials

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