Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

Journal article (2018)

Authors

Y. Liu Electronic Components, Technology and Materials - EEMCS , Harbin University of Science and Technology
Shengli Li Harbin University of Science and Technology
H. Zhang Harbin University of Science and Technology, Electronic Components, Technology and Materials - EEMCS
Hongming Cai Harbin University of Science and Technology
Fenglian Sun Harbin University of Science and Technology
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2018

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

This study investigated the interfacial reaction, the microstructure, and the hardness of the SAC305-xNi solder on both Cu and graphene-coated Cu (G–Cu) substrates. The experimental results indicate that the increase of Ni content in the solder leads to the roughness of the (Cu, Ni)6Sn5 IMC layer on Cu. In contrast, the growth of the (Cu, Ni)6Sn5 interfacial IMC, which results from increasing Ni addition, is significantly suppressed on G–Cu substrates. As the concentration of Ni ranges from 0 to 0.2 wt%, the microstructure of the solder bulks on Cu substrates shows slight changes. The hardness of the solder bulks in SAC305-Ni/Cu is similar to that in the SAC305/Cu solder joint. The amount of β-Sn rises and the eutectic area shrinks due to increasing Ni addition in the solder bulks on G–Cu substrates. Therefore, the solder bulks in the SAC305-Ni/G–Cu show lower hardness than that in the SAC305/G–Cu solder joint.

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