3D molecular interconnection technology

Crawley, D; Nikolic, K; Forshaw, M; Ackermann, J; Videlot, C; Nguyen, NT; Wang, L; Sarro, Pasqualina M

3D molecular interconnection technology

Journal article (2003)

Authors

D Crawley External organisation

K Nikolic External organisation

M Forshaw External organisation

J Ackermann External organisation

C Videlot External organisation

NT Nguyen Electronic Components, Technology and Materials -

L Wang Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

To reference this document use:

http://resolver.tudelft.nl/uuid:46993dd8-d998-495a-b68a-dd9bf0892e61

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Published Date

2003

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials