Automatic process design for 3D thick-film grayscale photolithography

Conference paper (2013)

Authors

F.C.M. van Kempen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Y Hirai External organisation
A. van Keulen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
O Tabata External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2013

Language

English

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

A novel process optimization tool for grayscale lithography is developed and demonstrated to fabricate three-dimensional (3D) microstructures using thick-film photoresists. For the first time, the two process parameters in grayscale lithography: exposure dose profile and
development time are determined automatically for a user-specified target 3D profile. This provides an inexpensive and effective alternative to conventional trialand-error based process design. The optimized parameters were verified by fabricating various 3D microstructures and the experiments revealed good quantitative agreement with the target profile
.
KEYWORDS
Grayscale Photolithography, 3D Microstructuring, Design Optimization, Automatic Process Design