Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages

Poliakov, A; Mendes, P; Sinaga, SM; Rajaei Salmasi, B.; Correia, J.H.; Burghartz, JN

Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages

Conference paper (2003)

Authors

A Poliakov Old - EWI Ch. Integrated Sensing Devices

P Mendes Electronic Components, Technology and Materials

SM Sinaga Old - EWI Ch. Integrated Sensing Devices

B. Rajaei Salmasi Old - EWI Ch. Integrated Sensing Devices

J.H. Correia External organisation

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

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Published Date

2003

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Research Group

Old - EWI Ch. Integrated Sensing Devices