System level methodology for interconnect aware and temperature constrained power management of 3D MP-SoCs

Journal article (2014)

Authors

Sumeet S. Kumar Signal Processing Systems - EEMCS
A Aggarwal External organisation
R Jagtap External organisation
A Zjajjo Signal Processing Systems - EEMCS
T.G.R.M. Van Leuken Signal Processing Systems - EEMCS
Research Group
Signal Processing Systems (EEMCS) (TU Delft)
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Published Date

2014

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Signal Processing Systems