Area-selective adhesive bonding using photosensitive bcb for wlcsp applications

Journal article (2005)

Authors

A Poliakov Old - EWI Ch. Integrated Sensing Devices
M. Bartek Old - EWI Ch. Integrated Sensing Devices
JN Burghartz Old - EWI Ch. Integrated Sensing Devices
Research Group
Old - EWI Ch. Integrated Sensing Devices
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Published Date

2005

Language

Undefined/Unknown

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Research Group

Old - EWI Ch. Integrated Sensing Devices

Abstract

This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5±3.9 J/m2 with tensile strength up to 71 MPa. The potential application of BCB bonding is demonstrated on a concept of wafer-level chip-scale package for RF applications and microfilter array for microfluidic applications. ©2005 ASME