Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnecting applications

Ackermann, J; Videlot, C; Nguyen, NT; Wang, L; Sarro, P. M.; Crawley, D; Nikolic, K; Forshaw, M

Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnecting applications

Journal article (2003)

Authors

J Ackermann External organisation

C Videlot External organisation

NT Nguyen Electronic Components, Technology and Materials

L Wang Electronic Components, Technology and Materials

P. M. Sarro Electronic Components, Technology and Materials

D Crawley External organisation

K Nikolic External organisation

M Forshaw External organisation

Research Group

Electronic Components, Technology and Materials

Elektrotechniek Techniek

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Published Date

2003

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Research Group

Electronic Components, Technology and Materials

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