Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes

Journal article (2017)

Authors

Yang Liu Harbin University of Science and Technology, Student
Haifeng Fu Harbin University of Science and Technology
Hao Zhang Harbin University of Science and Technology, Changzhou Institute of Technology Research for Solid State Lighting, Student
Fenglian Sun Harbin University of Science and Technology
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Xuan Wang Harbin University of Science and Technology
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2017

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Sn58Bi (SnBi) composite solder pastes were fabricated with various amounts of Sn–3.0Ag–0.5Cu (SAC) particles addition by mechanical mixing technic. The microstructure, hardness, and shear behavior of the solder joints were investigated. The experimental results indicate that the addition of SAC particles in the composite solder pastes significantly increases the concentration as well as the grain size of Sn and Bi-rich phase in the microstructure of the SnBi–SAC solder bulks. Meanwhile, the amount of submicron Bi grains increases because of increasing SAC content. The hardness of the solder bulks decreases as the percentage of SAC particles varies from 0 to 8 wt%, but increases when the doped percentage rises from 8 to 15 wt%. The shear force shows an ascending tendency because of the addition of SAC particles into the solder pastes with the range from 0 to 5 wt%. As the concentration of SAC increases to 8 wt% and even 15 wt%, large voids can be observed and the shear force of the solder joints decreases.

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